The recommended footprint for SMBJ5.0 is a standard SOD-123 package with a pad size of 0.8mm x 0.8mm and a spacing of 0.5mm between pads.
Yes, SMBJ5.0 is rated for operation up to 150°C, but it's recommended to derate the power dissipation according to the temperature derating curve in the datasheet.
To ensure reliability, follow proper PCB design and layout guidelines, use a suitable thermal pad, and ensure that the device is operated within its recommended operating conditions.
The typical response time of SMBJ5.0 is around 1-2 nanoseconds, but this can vary depending on the specific application and circuit conditions.
Yes, SMBJ5.0 can be used in a parallel configuration, but it's essential to ensure that the devices are properly matched and that the circuit is designed to handle the increased power rating.
