The recommended footprint and land pattern for SMBJ170A-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It is essential to follow the recommended footprint and land pattern to ensure proper soldering and to prevent thermal and mechanical stress on the component.
Handle the SMBJ170A-TP by the body, avoiding touching the leads or the glass passivation layer. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage. For rework, use a low-temperature soldering iron and a solder with a melting point below 250°C to prevent thermal damage.
The maximum allowable voltage derating for SMBJ170A-TP is typically 10-15% below the maximum rated voltage. However, it is recommended to consult the datasheet and application notes for specific derating guidelines, as excessive derating can affect the component's reliability and performance.
The SMBJ170A-TP is rated for operation up to 150°C. However, it is essential to consider the component's power dissipation, thermal resistance, and derating factors when operating in high-temperature environments. Consult the datasheet and application notes for specific guidance on high-temperature operation.
Ensure the SMBJ170A-TP is properly soldered by following the recommended soldering profile and using a solder with a melting point below 250°C. Inspect the solder joints for defects, such as cold solder joints, solder bridges, or excessive solder. Use a magnifying glass or microscope to inspect the joints, and consider using automated optical inspection (AOI) or X-ray inspection for high-volume production.
SMBJ170A-TP datasheet
by Micro Commercial Components
