The recommended footprint and land pattern for the SMBJ170A-13-F can be found in the Diodes Incorporated's package outline drawing, which is available on their website. The package is a standard SMB (DO-214AA) package, and the recommended land pattern is a rectangular pad with a size of 2.5mm x 1.5mm.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided by Diodes Incorporated. Use a solder with a melting point of 217°C to 220°C, and ensure the soldering iron temperature is set between 350°C to 370°C. Apply a small amount of solder paste to the pads, and use a soldering iron with a fine tip to solder the component.
The SMBJ170A-13-F has an operating temperature range of -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance.
Yes, the SMBJ170A-13-F is suitable for high-reliability applications. Diodes Incorporated follows a rigorous quality control process, and the device is manufactured using a high-reliability process. However, it's essential to follow proper design, testing, and validation procedures to ensure the device meets the specific requirements of the application.
Handle the SMBJ170A-13-F with care to prevent damage. Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. During shipping, ensure the devices are properly packaged and protected from mechanical shock and vibration.
SMBJ170A-13-F datasheet
by Diodes Incorporated
