The recommended land pattern for the SMBG170A-E3/52 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a solder mask clearance of 0.2 mm around the pad.
Yes, the SMBG170A-E3/52 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at temperatures above 125°C.
To prevent damage, handle the SMBG170A-E3/52 by the body only, avoiding touching the glass passivation or the metallization. Use anti-static precautions and avoid bending or flexing the leads.
The typical forward voltage drop of the SMBG170A-E3/52 is around 0.7 V to 0.9 V at a forward current of 1 A, depending on the junction temperature.
Yes, the SMBG170A-E3/52 can be used in switching applications, but it is not optimized for high-frequency switching. The device's switching performance may be limited by its internal capacitance and inductance.
SMBG170A-E3/52 datasheet
by Vishay Semiconductors
