The recommended footprint and land pattern for SMAZ24-13-F can be found in the Diodes Incorporated's package outline drawing or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure reliable soldering and to prevent thermal and mechanical stress.
To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curves and thermal management guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
The SMAZ24-13-F has an internal ESD protection diode, but it's still essential to follow standard ESD handling precautions, such as using an anti-static wrist strap, mat, or workstation, and storing the devices in anti-static packaging.
While the SMAZ24-13-F is primarily designed for transient voltage suppression, it can be used in high-frequency applications up to 1 GHz. However, it's essential to consider the device's parasitic capacitance and inductance, and to evaluate its performance in your specific application.
The recommended soldering profile for SMAZ24-13-F follows the standard reflow soldering profile, with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. It's essential to follow the recommended soldering profile to prevent thermal damage to the device.
SMAZ24-13-F datasheet
by Diodes Incorporated
