SM8S10AHE3/2D datasheet by Vishay Semiconductors

SM8S10AHE3/2D Frequently Asked Questions (FAQs)

• What is the recommended land pattern for SM8S10AHE3/2D?
  The recommended land pattern for SM8S10AHE3/2D can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for Surface Mount Components' (document number 28356).
• How do I handle the thermal management of SM8S10AHE3/2D?
  For proper thermal management, ensure a good thermal connection between the device and the PCB. Use a thermal pad or a thermal via under the device, and consider using a heat sink or a thermal interface material (TIM) if necessary. Refer to the Vishay Intertechnologies' application note 'Thermal Management of Surface Mount Devices' (document number 28355) for more information.
• What is the maximum allowable voltage derating for SM8S10AHE3/2D?
  The maximum allowable voltage derating for SM8S10AHE3/2D is typically 10% to 15% below the maximum rated voltage. However, it's recommended to consult with Vishay Intertechnologies' application engineers or refer to the device's reliability report for specific guidance.
• Can I use SM8S10AHE3/2D in a high-reliability or aerospace application?
  Yes, SM8S10AHE3/2D is suitable for high-reliability and aerospace applications. However, it's essential to consult with Vishay Intertechnologies' application engineers to ensure the device meets the specific requirements of your application, and to discuss any necessary screening, testing, or qualification procedures.
• How do I ensure the SM8S10AHE3/2D is properly soldered?
  Follow the recommended soldering profile and guidelines provided in the Vishay Intertechnologies' application note 'Soldering Methods and Procedures for Surface Mount Devices' (document number 28354). Ensure the soldering temperature and time are within the specified limits, and use a solder with a melting point compatible with the device's temperature rating.