The recommended land pattern for SM6T18CA-E3/5B is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a solder mask clearance of 0.2 mm. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal issues.
While the SM6T18CA-E3/5B is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 1 MHz. However, it's crucial to consider the device's parasitic capacitance and inductance, which may affect its performance at higher frequencies.
To ensure the reliability of the SM6T18CA-E3/5B in a high-temperature environment, it's essential to follow the recommended derating curves and to ensure that the device is operated within its specified temperature range. Additionally, consider using a heat sink or thermal interface material to reduce the device's junction temperature.
The SM6T18CA-E3/5B can handle a maximum surge current of 100 A for a duration of 10 ms. However, it's essential to consider the device's thermal limitations and to ensure that the surge current does not exceed the device's specified ratings.
Yes, you can use multiple SM6T18CA-E3/5B devices in a parallel configuration to increase the current rating. However, it's crucial to ensure that the devices are properly matched and that the current sharing is balanced to prevent overheating and reliability issues.
SM6T18CA-E3/5B datasheet
by Vishay Semiconductors
