Texas Instruments provides a recommended PCB layout for the SM320C6201GJCA20EP in the 'TMS320C62x/C67x PowerPAD Thermally Enhanced Package' application report (SLUA139). It includes guidelines for thermal vias, heat sinks, and PCB layer stackup.
Texas Instruments recommends using a boot loader that can handle errors and exceptions, such as the 'TMS320C62x/C67x Boot Loader' (SPRU613). Additionally, ensure that the boot process is robust against power-on reset, brown-out reset, and watchdog timer reset.
To minimize EMI and ensure EMC, follow the guidelines in the 'TMS320C62x/C67x EMI and EMC Considerations' application report (SLUA140). This includes using a solid ground plane, decoupling capacitors, and shielding, as well as following proper PCB layout and routing techniques.
Optimize performance by using the 'TMS320C62x/C67x Optimizing C/C++ Compiler Options' guide (SPRU615), which provides recommendations for compiler options, loop optimization, and cache usage. Additionally, consider using the 'TMS320C62x/C67x Cycle Accurate Simulator' (SPRU616) to simulate and optimize your code.
The SM320C6201GJCA20EP is rated for operation up to 125°C. However, high temperatures can affect the device's performance, power consumption, and reliability. Consult the 'TMS320C62x/C67x Reliability and High-Temperature Operation' application report (SLUA141) for guidelines on thermal management, derating, and reliability considerations.
SM320C6201GJCA20EP datasheet
by Texas Instruments
