A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern on the PCB are also recommended.
Ensure proper heat sinking, avoid overheating during soldering, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
The recommended soldering conditions are: peak temperature 260°C, time above 217°C 30s, and time above 183°C 60s. Avoid using wave soldering or exceeding the recommended temperature profile.
Handle the device with ESD-protective equipment, such as wrist straps or mats. Ensure the device is stored in an ESD-protective package, and avoid touching the pins or leads during handling.
Store the device in a dry, cool place (temperature range: 5°C to 30°C, humidity < 60%). Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
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