The recommended PCB footprint for the SIR836DP-T1-GE3 is a pad layout with a minimum size of 2.5 mm x 2.5 mm, with a thermal pad size of 1.5 mm x 1.5 mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the SIR836DP-T1-GE3 on the pads. Use a reflow oven or a hot air gun to solder the component. Make sure to follow the recommended soldering profile to prevent damage to the device.
The maximum operating temperature range for the SIR836DP-T1-GE3 is -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
The SIR836DP-T1-GE3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use the device in a humid environment, ensure that the PCB is properly coated with a moisture-resistant material, and follow proper handling and storage procedures to minimize the risk of moisture ingress.
Store the SIR836DP-T1-GE3 in a dry, cool place with a temperature range of 20°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures during storage.
SIR836DP-T1-GE3 datasheet
by Vishay Siliconix
Findchips
Findchips