The recommended PCB footprint for the SIR460DP-T1-GE3 is a pad size of 5.5 mm x 3.5 mm with a 1.5 mm x 1.5 mm thermal pad. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the component. Use a reflow oven or a hot air gun to solder the component. Avoid overheating, as it can damage the component.
The maximum operating temperature range for the SIR460DP-T1-GE3 is -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
The SIR460DP-T1-GE3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use it in such an environment, ensure the device is properly sealed or coated to prevent moisture ingress.
Store the SIR460DP-T1-GE3 in a dry, cool place with a temperature range of 20°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
SIR460DP-T1-GE3 datasheet
by Vishay Siliconix
