The recommended PCB footprint for the SIR428DP-T1-GE3 is a rectangle with dimensions of 5.1 mm x 6.4 mm, with a thermal pad in the center. The pad should be connected to a solid copper area on the PCB to ensure good thermal dissipation.
To ensure reliable soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the pads. Use a reflow oven or a hot air gun to solder the component, and avoid using excessive force or vibration during the process.
The maximum operating temperature range for the SIR428DP-T1-GE3 is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at temperatures above 125°C for extended periods.
The SIR428DP-T1-GE3 is not designed for use in high-humidity environments. It is recommended to use a conformal coating or potting compound to protect the device from moisture and humidity. Additionally, ensure that the PCB is designed with moisture-resistant materials and follows proper humidity-resistant design practices.
The SIR428DP-T1-GE3 is an ESD-sensitive device. Handle the component with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, to prevent damage from electrostatic discharge.
SIR428DP-T1-GE3 datasheet
by Vishay Siliconix
Findchips
Findchips