The recommended PCB footprint for the SIE882DF-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure the SIE882DF-T1-GE3 operates within its SOA, ensure the maximum voltage rating of 100 V is not exceeded, and the maximum current rating of 2 A is not exceeded. Additionally, ensure the device is operated within the recommended temperature range of -55°C to 150°C.
The thermal resistance of the SIE882DF-T1-GE3 is 25°C/W (junction-to-ambient) and 10°C/W (junction-to-case).
Yes, the SIE882DF-T1-GE3 is suitable for high-frequency applications up to 1 MHz. However, it's essential to consider the device's parasitic capacitance and inductance when designing the circuit.
Yes, the SIE882DF-T1-GE3 is compatible with lead-free soldering processes, with a peak reflow temperature of 260°C.
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