SI9934BDY-T1-E3 datasheet by Vishay Siliconix

SI9934BDY-T1-E3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI9934BDY-T1-E3?
  The recommended PCB footprint for the SI9934BDY-T1-E3 is a 3x3mm QFN package with a 0.5mm pitch. A recommended land pattern can be found in the Vishay Intertechnologies' application note 'QFN Land Pattern' (document number 81011).
• How do I ensure the SI9934BDY-T1-E3 is properly soldered to the PCB?
  To ensure proper soldering, follow the recommended soldering profile and guidelines provided in the Vishay Intertechnologies' application note 'Soldering Methods and Procedures for Surface Mount Devices' (document number 81010). Additionally, use a solder with a melting point above 217°C to prevent damage to the device.
• What is the maximum operating temperature range for the SI9934BDY-T1-E3?
  The maximum operating temperature range for the SI9934BDY-T1-E3 is -40°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
• Can I use the SI9934BDY-T1-E3 in a high-reliability or automotive application?
  Yes, the SI9934BDY-T1-E3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 qualification standard and is manufactured in accordance with IATF 16949:2016 quality management system standards.
• How do I handle ESD protection for the SI9934BDY-T1-E3 during handling and assembly?
  To prevent electrostatic discharge (ESD) damage, handle the SI9934BDY-T1-E3 with ESD-protective equipment and follow proper ESD handling procedures. The device has an ESD rating of 2 kV human body model (HBM) and 250 V machine model (MM).