The recommended PCB footprint for the SI9112DY-T1-E3 is a 5-pin SOT23 package with a 1.5mm x 2.5mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for each pin.
To ensure the SI9112DY-T1-E3 operates within its recommended operating conditions, maintain a voltage supply between 2.7V and 5.5V, and keep the junction temperature (TJ) below 150°C. Also, ensure the device is operated within its specified frequency range.
The maximum allowable power dissipation for the SI9112DY-T1-E3 is 250mW. Exceeding this limit may cause the device to overheat, leading to reduced performance or even failure.
To prevent electrostatic discharge (ESD) damage, handle the SI9112DY-T1-E3 with an anti-static wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or exposed internal components.
Store the SI9112DY-T1-E3 in a dry, cool place with a temperature range of -40°C to 125°C. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
SI9112DY-T1-E3 datasheet
by Vishay Siliconix
