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    SI8901EDB-T2-E1 datasheet by Vishay Siliconix

    • FETs - Arrays, Discrete Semiconductor Products, MOSFET 2P-CH 20V 3.5A 6-MFP
    • Original
    • Yes
    • Yes
    • Obsolete
    • EAR99
    • Find it at Findchips.com
    • Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

    SI8901EDB-T2-E1 datasheet preview

    SI8901EDB-T2-E1 Frequently Asked Questions (FAQs)

    • Vishay recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
    • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive interface material, and keeping the device within its specified operating temperature range.
    • The maximum allowed voltage on the enable pin (EN) is 6 V. Exceeding this voltage may damage the device. It's recommended to use a voltage limiter or a resistor divider to ensure the enable pin voltage remains within the specified range.
    • While the SI8901EDB-T2-E1 is designed for high-frequency operation, it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the application's switching frequency is within the device's specified range. Additionally, proper PCB layout and decoupling are crucial to minimize electromagnetic interference (EMI) and ensure reliable operation.
    • Vishay recommends following proper ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging. Additionally, the device has built-in ESD protection, but it's still important to follow proper handling and assembly procedures to prevent damage.
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