For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a thermal relief pattern under the package. The thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it is essential to follow proper thermal management practices, such as providing adequate heat sinking, using a heat spreader, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range.
The recommended soldering conditions for the SI7964DP-T1-E3 are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. It is also recommended to use a solder with a melting point of 220°C or higher.
The SI7964DP-T1-E3 is a commercial-grade device, and its use in high-reliability or aerospace applications may require additional testing and qualification. It is recommended to consult with Vishay Intertechnologies or a qualified reliability engineer to determine the device's suitability for such applications.
To prevent electrostatic discharge (ESD) damage, it is recommended to handle the device in an ESD-protected environment, use ESD-protective packaging, and follow proper grounding procedures during assembly. Additionally, the device should be stored in an anti-static bag or container when not in use.
SI7964DP-T1-E3 datasheet
by Vishay Siliconix
