The recommended PCB footprint for the SI7611DN-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 4.5 V and 5.5 V, and the enable pin (EN) to a logic-level signal (0 V or 5 V) to control the device's on/off state.
The SI7611DN-T1-GE3 is rated for operation from -40°C to 150°C (junction temperature), but the recommended operating temperature range is -20°C to 85°C for optimal performance and reliability.
To prevent electrostatic discharge (ESD) damage, handle the SI7611DN-T1-GE3 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or handling it in environments with high electrostatic potential.
Store the SI7611DN-T1-GE3 in its original packaging or in a dry, cool place (less than 30°C and 60% relative humidity) to prevent moisture absorption and damage.
