The recommended PCB footprint for the SI7489DP-T1-GE3 is a standard SOT23-6 package with a 1.8mm x 1.4mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V to 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to ensure stability.
The SI7489DP-T1-GE3 is capable of delivering up to 1A of continuous output current. However, it's recommended to derate the output current to 0.8A for optimal reliability and thermal performance.
The SI7489DP-T1-GE3 has built-in input voltage transient protection and noise filtering. However, it's still recommended to add external input capacitors (e.g., 10uF ceramic) to further reduce noise and ripple.
The thermal resistance (RθJA) of the SI7489DP-T1-GE3 package is approximately 150°C/W. This means that for every watt of power dissipation, the junction temperature will increase by 150°C above the ambient temperature.
SI7489DP-T1-GE3 datasheet
by Vishay Siliconix
