SI7464DP-T1-E3 datasheet by Vishay Siliconix

SI7464DP-T1-E3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI7464DP-T1-E3?
  The recommended PCB footprint for the SI7464DP-T1-E3 is a standard SO-8 package with a 1.27mm pitch. A recommended land pattern is available in the Vishay Intertechnologies' application note AN-1033.
• How do I ensure the SI7464DP-T1-E3 is properly soldered onto the PCB?
  To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Vishay Intertechnologies' application note AN-1033. Additionally, use a solder with a melting point below 260°C to prevent damage to the device.
• What is the maximum allowed power dissipation for the SI7464DP-T1-E3?
  The maximum allowed power dissipation for the SI7464DP-T1-E3 is 1.4W at an ambient temperature of 25°C. However, this value can be derated based on the operating temperature and PCB design. Refer to the datasheet for more information.
• Can I use the SI7464DP-T1-E3 in a high-reliability or automotive application?
  Yes, the SI7464DP-T1-E3 is qualified for automotive and high-reliability applications. It meets the AEC-Q101 qualification standard and is PPAP capable. However, it's essential to consult with Vishay Intertechnologies' sales team to ensure the device meets the specific requirements of your application.
• How do I handle ESD protection when handling the SI7464DP-T1-E3?
  To prevent electrostatic discharge (ESD) damage, handle the SI7464DP-T1-E3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure the workspace is ESD-safe, and follow proper handling and storage procedures.