The recommended PCB footprint for the SI7460DP-T1-GE3 is a standard SOT23-6 package with a 1.6mm x 2.9mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V to 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor.
The SI7460DP-T1-GE3 is capable of delivering up to 1A of output current. However, it's recommended to limit the output current to 500mA for optimal thermal performance and to prevent overheating.
To protect the SI7460DP-T1-GE3 from overvoltage and undervoltage conditions, add a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it falls outside the recommended operating range.
The thermal derating curve for the SI7460DP-T1-GE3 is typically 1.5% per degree Celsius above 25°C. This means that for every 1°C increase in temperature above 25°C, the maximum output current capability decreases by 1.5%.
SI7460DP-T1-GE3 datasheet
by Vishay Siliconix
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