The recommended PCB footprint for the SI7456CDP-T1-GE3 is a standard SOIC-8 package with a 1.27mm pitch. A recommended land pattern is available in the Vishay Intertechnologies' application note AN81184.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Vishay Intertechnologies' application note AN81184. Additionally, use a solder with a melting point below 260°C to prevent damage to the device.
The SI7456CDP-T1-GE3 has an operating temperature range of -55°C to 150°C. However, the device's performance and reliability may degrade if operated outside the recommended temperature range of -40°C to 125°C.
To prevent electrostatic discharge (ESD) damage, handle the SI7456CDP-T1-GE3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure the workspace is ESD-safe and follow proper handling procedures.
Store the SI7456CDP-T1-GE3 in a dry, cool place with a relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
SI7456CDP-T1-GE3 datasheet
by Vishay Siliconix
