The recommended PCB footprint for the SI7309DN-T1-GE3 is a 5x5 mm QFN package with a 0.5 mm pitch. A detailed footprint recommendation can be found in the Vishay Intertechnologies application note AN81142.
To ensure proper soldering, follow the recommended soldering profile and guidelines outlined in the Vishay Intertechnologies application note AN81142. Additionally, use a solder with a melting point below 260°C to prevent damage to the device.
The SI7309DN-T1-GE3 has an operating temperature range of -40°C to 125°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
Yes, the SI7309DN-T1-GE3 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is PPAP capable. However, additional testing and validation may be required for specific applications.
To prevent ESD damage, handle the SI7309DN-T1-GE3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the device is stored in a conductive bag or tube when not in use.
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