The recommended PCB footprint for the SI7117DN-T1-GE3 is a 5x5 mm QFN package with a 0.5 mm pitch. A thermal pad is recommended for optimal thermal performance.
To ensure proper soldering, follow the recommended reflow soldering profile, and use a solder paste with a melting point between 217°C to 220°C. Avoid excessive soldering temperatures and times to prevent damage to the device.
The SI7117DN-T1-GE3 is rated for operation from -40°C to 150°C (TJ). However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
Yes, the SI7117DN-T1-GE3 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured in accordance with IATF 16949:2016 standards.
Handle the SI7117DN-T1-GE3 with ESD-protective equipment and follow proper ESD handling procedures to prevent damage. The device has an HBM ESD rating of 2 kV and a CDM ESD rating of 1 kV.
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