The recommended PCB footprint for the SI7117DN-T1-E3 is a 5x5 mm QFN package with a 0.5 mm pitch. A reference footprint can be found in the Vishay Intertechnologies' application note or on the manufacturer's website.
To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB, connect it to a solid ground plane, and use thermal vias to dissipate heat. Additionally, ensure good airflow around the device and avoid blocking airflow with nearby components.
The SI7117DN-T1-E3 has an operating temperature range of -40°C to 150°C. However, it's essential to note that the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
Yes, the SI7117DN-T1-E3 is qualified for automotive and high-reliability applications. It meets the AEC-Q100 standard and is PPAP capable. However, it's essential to consult with Vishay Intertechnologies' application engineers to ensure the device meets the specific requirements of your application.
The SI7117DN-T1-E3 is an ESD-sensitive device. To prevent damage, handle the device with ESD-protective equipment, wear an ESD strap, and ensure the workspace is ESD-safe. Follow standard ESD handling procedures during assembly and storage.
