The recommended PCB footprint for the SI7115DN-T1-E3 is a 5x5 mm QFN package with a 0.5 mm pitch. A detailed footprint recommendation can be found in the Vishay Intertechnologies application note AN81110.
To ensure proper soldering, follow the recommended soldering profile and guidelines outlined in the Vishay Intertechnologies application note AN81110. Additionally, use a solder with a melting point below 260°C to prevent damage to the device.
The SI7115DN-T1-E3 has an operating temperature range of -40°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
Yes, the SI7115DN-T1-E3 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, it's essential to consult with Vishay Intertechnologies' technical support to ensure the device meets the specific requirements of your application.
To prevent electrostatic discharge (ESD) damage, handle the SI7115DN-T1-E3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure the workspace is ESD-safe, and follow proper handling and storage procedures outlined in the Vishay Intertechnologies application note AN81110.
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