The recommended PCB footprint for the SI7114DN-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a maximum pad size of 1.2 mm x 1.2 mm, with a 0.5 mm spacing between pads.
To ensure proper biasing, connect the VCC pin to a stable 2.5 V to 5.5 V power supply, and the GND pin to a solid ground plane. The input pins (IN+ and IN-) should be biased to a voltage within the common-mode range (VCC - 1.5 V to VCC + 0.5 V) for optimal performance.
The maximum allowable power dissipation for the SI7114DN-T1-GE3 is 250 mW, which is calculated based on the package thermal resistance (RθJA) of 125°C/W and the maximum junction temperature (TJ) of 150°C.
To protect the SI7114DN-T1-GE3 from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB has adequate ESD protection, such as TVS diodes or ESD protection arrays, on the input and output lines.
The recommended operating temperature range for the SI7114DN-T1-GE3 is -40°C to 125°C, with a maximum junction temperature (TJ) of 150°C.
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