The recommended PCB footprint for the SI7114ADN-T1-GE3 is a 5x5 mm QFN package with a 0.5 mm pitch. A minimum of 2 mm clearance around the device is recommended for thermal and electrical considerations.
To ensure the device operates within the specified junction temperature (Tj) range, provide adequate heat sinking, use a thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device.
The recommended input capacitance value for the SI7114ADN-T1-GE3 is 10 nF to 100 nF, depending on the specific application and noise requirements. A higher capacitance value can help reduce noise and improve stability.
Yes, the SI7114ADN-T1-GE3 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q100 and is manufactured in accordance with IATF 16949.
Handle the device by the package body only, avoiding touching the leads or electrical contacts. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
