The recommended PCB footprint for the SI6544BDQ-T1-E3 is a QFN-16 package with a 3x3 mm body size and 0.5 mm pitch. A recommended land pattern can be found in the Vishay Intertechnologies' application note 'QFN-16 Land Pattern' (document number 81011).
To ensure reliable operation of the SI6544BDQ-T1-E3 in high-temperature environments, it is essential to follow proper thermal management practices. This includes providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range of -40°C to 150°C.
The maximum allowed voltage on the enable pin (EN) of the SI6544BDQ-T1-E3 is 6 V. Exceeding this voltage may cause damage to the device.
Yes, the SI6544BDQ-T1-E3 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q100 standard and is manufactured in accordance with Vishay Intertechnologies' quality and reliability standards.
To prevent damage during storage and shipping, the SI6544BDQ-T1-E3 should be stored in its original packaging or in a similar anti-static package. The device should be handled with anti-static precautions, such as using an anti-static wrist strap or mat, to prevent electrostatic discharge (ESD) damage.