The recommended PCB footprint for SI4890DY-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a 0.5mm spacing between pads.
To ensure reliability in high-temperature applications, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and avoiding excessive power dissipation. Additionally, the device should be operated within its specified temperature range of -55°C to 150°C.
The maximum allowed voltage on the enable pin (EN) of the SI4890DY-T1-E3 is 6V, which is the maximum rating for the logic input voltage. Exceeding this voltage may cause damage to the device.
Yes, the SI4890DY-T1-E3 is suitable for use in switching regulator applications due to its high-frequency capability and low RDS(on) characteristics. However, it is essential to ensure that the device is operated within its specified power dissipation limits and that proper thermal management is implemented.
To calculate the power dissipation of the SI4890DY-T1-E3, you need to consider the voltage drop across the device, the current flowing through it, and the operating frequency. The power dissipation can be calculated using the formula: Pd = (Vds x Ids) + (Vgs x Igs) + (f x Ciss x Vds^2), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, Igs is the gate-source current, f is the operating frequency, and Ciss is the input capacitance.
SI4890DY-T1-E3 datasheet
by Vishay Siliconix
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