The recommended PCB footprint for the SI4425BDY-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
The maximum operating temperature range for the SI4425BDY-T1-GE3 is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
To prevent ESD damage, handle the SI4425BDY-T1-GE3 with an ESD wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.
Store the SI4425BDY-T1-GE3 in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
SI4425BDY-T1-GE3 datasheet
by Vishay Siliconix
Findchips
Findchips