The recommended PCB footprint for the SI4410BDY-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5 V and 5.5 V, and the enable pin (EN) to a logic-level signal (0 V or VIN).
The SI4410BDY-T1-E3 has an operating temperature range of -40°C to 125°C, making it suitable for a wide range of industrial and automotive applications.
To protect the SI4410BDY-T1-E3 from ESD, handle the device with an anti-static wrist strap or mat, and ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays.
The typical quiescent current (IQ) of the SI4410BDY-T1-E3 is 10 μA, making it suitable for low-power applications.