The recommended PCB footprint for the SI3585CDV-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and the enable pin (EN) to a logic-level signal. The output pin (VOUT) should be decoupled with a 10 μF ceramic capacitor and a 1 μF ceramic capacitor in parallel.
The SI3585CDV-T1-GE3 is rated for operation in an ambient temperature range of -40°C to +125°C.
Yes, the SI3585CDV-T1-GE3 is qualified to AEC-Q100 Grade 1, making it suitable for high-reliability applications such as automotive and industrial systems.
To prevent ESD damage, handle the SI3585CDV-T1-GE3 with an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.
SI3585CDV-T1-GE3 datasheet
by Vishay Siliconix
