The recommended PCB footprint for the SI3473CDV-T1-GE3 is a 6-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure the device operates within the recommended operating conditions, ensure the input voltage is within the specified range (1.8 V to 5.5 V), the ambient temperature is within the specified range (-40°C to 125°C), and the device is not exposed to excessive moisture or humidity.
The maximum power dissipation of the SI3473CDV-T1-GE3 is 1.4 W at an ambient temperature of 25°C. However, this value may vary depending on the specific application and operating conditions.
To handle ESD protection for the SI3473CDV-T1-GE3, ensure that the device is handled and stored in an ESD-protected environment, and follow proper ESD handling procedures during assembly and testing.
The recommended storage temperature range for the SI3473CDV-T1-GE3 is -40°C to 125°C, and the recommended storage humidity range is 20% to 80% relative humidity.