SI3459BDV-T1-GE3 datasheet by Vishay Siliconix

SI3459BDV-T1-GE3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI3459BDV-T1-GE3?
  The recommended PCB footprint for the SI3459BDV-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
• How do I ensure the SI3459BDV-T1-GE3 operates within its safe operating area (SOA)?
  To ensure the SI3459BDV-T1-GE3 operates within its SOA, ensure the maximum voltage rating is not exceeded, and the device is operated within the recommended temperature range of -40°C to 150°C. Additionally, follow proper thermal management and PCB design guidelines to prevent overheating.
• What is the maximum allowed power dissipation for the SI3459BDV-T1-GE3?
  The maximum allowed power dissipation for the SI3459BDV-T1-GE3 is 1.4 W at an ambient temperature of 25°C. However, this value may vary depending on the specific application and operating conditions.
• Can I use the SI3459BDV-T1-GE3 in a high-reliability or automotive application?
  Yes, the SI3459BDV-T1-GE3 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is manufactured in accordance with IATF 16949.
• How do I handle the SI3459BDV-T1-GE3 during storage and shipping to prevent damage?
  To prevent damage, store the SI3459BDV-T1-GE3 in its original packaging or an equivalent ESD-protective package. Avoid exposing the device to extreme temperatures, humidity, or physical stress during storage and shipping.