The recommended PCB footprint for the SI3440DV-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5 V and 5.5 V, and the enable pin (EN) to a logic-level signal or a voltage source between 0 V and VIN. The output pin (VOUT) should be decoupled with a 1 μF ceramic capacitor.
The SI3440DV-T1-E3 can deliver up to 1 A of output current, but it's recommended to limit the output current to 500 mA for optimal performance and thermal management.
To ensure proper thermal management, provide a thermal pad on the PCB, use a heat sink if necessary, and maintain a maximum junction temperature (TJ) of 125°C. Also, ensure good airflow and avoid blocking the airflow around the device.
Yes, the SI3440DV-T1-E3 is AEC-Q100 qualified, making it suitable for automotive applications. However, it's essential to follow the recommended operating conditions and ensure the device is used within its specified ratings.
SI3440DV-T1-E3 datasheet
by Vishay Siliconix
