The recommended PCB footprint for the SI2377EDS-T1-GE3 is a 4-pad land pattern with a pitch of 0.5 mm and a pad size of 0.6 mm x 0.6 mm. It's essential to follow the recommended footprint to ensure proper thermal and electrical performance.
To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C. Apply a small amount of solder paste to the PCB pads, and then place the SI2377EDS-T1-GE3 on the pads. Use a reflow oven or a hot air gun to solder the device. Avoid overheating or applying excessive force, which can damage the device.
The SI2377EDS-T1-GE3 has an operating temperature range of -40°C to 150°C. However, it's essential to note that the device's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the device within a temperature range of 0°C to 125°C for optimal performance.
The SI2377EDS-T1-GE3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if you must use the device in a humid environment, ensure that the PCB is properly coated with a moisture-resistant material, and the device is properly sealed to prevent moisture ingress.
Store the SI2377EDS-T1-GE3 in a dry, cool place with a temperature range of 20°C to 30°C and a relative humidity of 50% to 60%. Avoid storing the device in direct sunlight, high temperatures, or high humidity environments.
SI2377EDS-T1-GE3 datasheet
by Vishay Siliconix
Findchips
Findchips