The recommended PCB footprint for the SI2323CDS-T1-GE3 is a standard SOT23-6 package with a 1.5mm x 1.5mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for reliable soldering.
To ensure the SI2323CDS-T1-GE3 operates within its recommended operating conditions, maintain a supply voltage between 2.7V and 5.5V, and keep the junction temperature below 150°C. Also, ensure the input voltage does not exceed the maximum rating of 5.5V.
The SI2323CDS-T1-GE3 supports data rates up to 100 Mbps, making it suitable for high-speed applications.
To ensure ESD protection, handle the SI2323CDS-T1-GE3 with an anti-static wrist strap or mat, and store the device in an anti-static bag or container. Also, follow proper PCB design guidelines for ESD protection.
The SI2323CDS-T1-GE3 is rated for operation up to 125°C. However, for high-temperature applications above 125°C, consult with Vishay Intertechnologies or a qualified engineer to ensure the device meets the specific application requirements.
SI2323CDS-T1-GE3 datasheet
by Vishay Siliconix
