The recommended PCB footprint for the SI2308BDS-T1-E3 is a 5-pin SOT23 package with a 1.5mm x 2.5mm body size. A minimum pad size of 0.5mm x 0.5mm is recommended for each pin.
To ensure proper biasing, connect the VCC pin to a stable 2.5V to 5.5V power supply, and the GND pin to a solid ground plane. The EN pin should be tied to VCC or a digital signal for enable/disable functionality.
The maximum current rating for the SI2308BDS-T1-E3 is 1.5A per channel, with a total current limit of 3A for all three channels combined.
To protect the SI2308BDS-T1-E3 from ESD and overvoltage, use a TVS diode or a zener diode on the input pins, and consider adding a series resistor to limit the current in case of an overvoltage event.
The operating temperature range for the SI2308BDS-T1-E3 is -40°C to 125°C, with a storage temperature range of -55°C to 150°C.