SI2303CDS-T1-GE3 datasheet by Vishay Siliconix

SI2303CDS-T1-GE3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI2303CDS-T1-GE3?
  The recommended PCB footprint for the SI2303CDS-T1-GE3 is a 6-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
• How do I ensure the SI2303CDS-T1-GE3 is properly biased for optimal performance?
  To ensure proper biasing, connect the input pin (VIN) to a stable voltage source, and the enable pin (EN) to a logic-level signal. The output pin (VOUT) should be decoupled with a 10 μF ceramic capacitor.
• What is the maximum ambient temperature range for the SI2303CDS-T1-GE3?
  The SI2303CDS-T1-GE3 is rated for operation in an ambient temperature range of -40°C to +125°C.
• Can I use the SI2303CDS-T1-GE3 in a high-reliability application?
  Yes, the SI2303CDS-T1-GE3 is qualified to AEC-Q100, making it suitable for high-reliability applications such as automotive and industrial systems.
• How do I calculate the power dissipation of the SI2303CDS-T1-GE3?
  To calculate power dissipation, use the formula: Pd = (VIN - VOUT) x IOUT. Ensure the calculated power dissipation does not exceed the maximum rating of 1.5 W.