SI1958DH-T1-E3 datasheet by Vishay Siliconix

SI1958DH-T1-E3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI1958DH-T1-E3?
  The recommended PCB footprint for the SI1958DH-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a maximum pad size of 1.2 mm x 1.2 mm, with a 0.5 mm spacing between pads.
• How do I ensure the SI1958DH-T1-E3 is properly soldered to the PCB?
  To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pads. Use a solder with a melting point of 217°C to 220°C, and avoid applying excessive heat or pressure, which can damage the device.
• What is the maximum operating temperature range for the SI1958DH-T1-E3?
  The maximum operating temperature range for the SI1958DH-T1-E3 is -55°C to 150°C, with a storage temperature range of -55°C to 175°C.
• How do I handle ESD protection when working with the SI1958DH-T1-E3?
  To prevent electrostatic discharge (ESD) damage, handle the SI1958DH-T1-E3 with an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded. Avoid touching the device's pins or exposed internal components.
• What is the recommended input voltage range for the SI1958DH-T1-E3?
  The recommended input voltage range for the SI1958DH-T1-E3 is 4.5 V to 5.5 V, with a maximum input voltage of 6.5 V for a short duration (less than 100 ms).