SI1902DL-T1-GE3 datasheet by Vishay Siliconix

SI1902DL-T1-GE3 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the SI1902DL-T1-GE3?
  The recommended land pattern for the SI1902DL-T1-GE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendation for QFN Packages' (document number: 81011).
• How do I handle the thermal pad on the SI1902DL-T1-GE3?
  The thermal pad on the SI1902DL-T1-GE3 should be connected to a solid ground plane to ensure optimal thermal performance. A thermal via or a thermal pad connection to the ground plane is recommended.
• What is the maximum operating temperature range for the SI1902DL-T1-GE3?
  The maximum operating temperature range for the SI1902DL-T1-GE3 is -55°C to 150°C. However, the device's performance may degrade at extreme temperatures, and the recommended operating temperature range is -40°C to 125°C.
• Can I use the SI1902DL-T1-GE3 in a high-reliability application?
  Yes, the SI1902DL-T1-GE3 is suitable for high-reliability applications. It is manufactured using a qualified process and is compliant with the Automotive Electronics Council (AEC) Q100 and Q101 standards.
• How do I ensure the SI1902DL-T1-GE3 is properly soldered?
  To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Vishay Intertechnologies' application note 'Soldering Profile for QFN Packages' (document number: 81012).