The recommended land pattern for the SI1902CDL-T1-GE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendation for QFN Packages' (document number: 37942).
The thermal pad on the SI1902CDL-T1-GE3 should be connected to a solid ground plane to ensure optimal thermal performance. A thermal via or a thermal pad connection to the ground plane is recommended.
The maximum operating temperature range for the SI1902CDL-T1-GE3 is -40°C to 150°C. However, the device can be stored at temperatures between -40°C and 150°C.
Yes, the SI1902CDL-T1-GE3 is qualified to AEC-Q101, which makes it suitable for high-reliability applications such as automotive systems.
To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Vishay Intertechnologies' application note 'Soldering Profile for QFN Packages' (document number: 37943).
