SI1016CX-T1-GE3 datasheet by Vishay Siliconix

SI1016CX-T1-GE3 Frequently Asked Questions (FAQs)

• What is the recommended PCB footprint for the SI1016CX-T1-GE3?
  The recommended PCB footprint for the SI1016CX-T1-GE3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
• How do I ensure the SI1016CX-T1-GE3 operates within its recommended operating conditions?
  To ensure the SI1016CX-T1-GE3 operates within its recommended operating conditions, maintain a voltage supply between 2.7V and 5.5V, and keep the junction temperature (TJ) below 150°C. Also, ensure the device is operated within its specified frequency range.
• What is the maximum allowable power dissipation for the SI1016CX-T1-GE3?
  The maximum allowable power dissipation for the SI1016CX-T1-GE3 is 250mW. Exceeding this limit may cause the device to overheat, leading to reduced performance or even failure.
• How do I handle ESD protection when working with the SI1016CX-T1-GE3?
  To prevent electrostatic discharge (ESD) damage, handle the SI1016CX-T1-GE3 with an ESD wrist strap or mat, and ensure the workspace is ESD-protected. Avoid touching the device's pins or exposed internal components.
• What is the recommended storage condition for the SI1016CX-T1-GE3?
  Store the SI1016CX-T1-GE3 in a dry, cool place with a temperature range of -40°C to 125°C. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.