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GHz BGA Sockets-1.0mm; IC Size X (mm): 29; IC Size Y (mm): 29; IC Array X: 28; IC Array Y: 28; Max Pincount: 784; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.2; IC Ball Diameter Max (mm): 0.7; IC Ball Height Max (mm): 0.5; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.2; IC Total Height Max (mm): 3.5; Max Package Code: BGA784; Backing Plate: yes; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)
