GHz BGA Sockets-1.0mm; IC Size X (mm): 16; IC Size Y (mm): 16; IC Array X: 15; IC Array Y: 15; Max Pincount: 225; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.12; IC Ball Diameter Max (mm): 0.55; IC Ball Height Max (mm): 0.45; IC Ball Height Min (mm): 0.35; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.4; Max Package Code: BGA225; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)
