GHz BGA Sockets-1.0mm; IC Size X (mm): 13; IC Size Y (mm): 15; IC Array X: 11; IC Array Y: 15; Max Pincount: 165; Top Pitch (mm): 1; IC Ball Coplanarity (mm): 0.1; IC Ball Diameter Max (mm): 0.5; IC Ball Height Max (mm): 0.4; IC Ball Height Min (mm): 0.3; IC Size Tolerance (mm): 0.1; IC Total Height Max (mm): 1.2; Max Package Code: BGA165C; Backing Plate: no; Cavity Down: no; Heat Sink: no; IC Top Surface: Flat; Socket Lid: Swivel; Part Description: GHz BGA Socket (ZIF)
