API Delevan recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A minimum of 2 oz copper thickness is recommended for the top layer. Additionally, a thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
The SDS850R-184M requires a bias tee or a DC block to provide the necessary DC voltage and current. The recommended bias voltage is 12V to 15V, and the current limit should be set to 100mA to 200mA. It's essential to follow the recommended biasing scheme to avoid damage to the device.
The SDS850R-184M is rated for operation from -40°C to +85°C. However, the device's performance may degrade at higher temperatures, and it's recommended to keep the operating temperature below 70°C for optimal performance and reliability.
The SDS850R-184M is an ESD-sensitive device and requires proper handling and protection. API Delevan recommends using an ESD wrist strap or mat, and storing the device in an anti-static bag or container. Additionally, the device should be handled in a static-free environment, and ESD protection devices should be used on the PCB.
API Delevan recommends a soldering profile with a peak temperature of 260°C to 270°C, and a dwell time of 10 seconds to 30 seconds. The device should be soldered using a no-clean or water-soluble flux, and the PCB should be cleaned after soldering to prevent contamination.
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