A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
Implement a thermal management system, such as a heat sink or fan, to maintain a junction temperature below 150°C. Ensure proper PCB design, component selection, and thermal interface material usage.
Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF values, and for output capacitors, use 4.7uF to 10uF values.
Enable the low-power mode by pulling the EN pin low. Ensure that the input voltage is within the recommended range, and minimize the output voltage to reduce power consumption.
Use a common-mode choke (e.g., 1uH to 10uH) and a differential-mode inductor (e.g., 1uH to 10uH) in series with the input capacitors. Add a 10nF to 100nF X-capacitor between the input lines.
