A good PCB layout for SD101AWS-7 involves keeping the input and output traces short and separate, using a solid ground plane, and placing bypass capacitors close to the device. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
Proper thermal management involves attaching the device to a heat sink or a metal pad on the PCB, using thermal interface material, and ensuring good airflow around the device. The maximum junction temperature (Tj) should not exceed 150°C.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling, placed as close to the device as possible. The capacitor should be rated for the input voltage and have a low ESR.
While the SD101AWS-7 is rated for operation up to 125°C, it's essential to consider the derating of the device's performance and reliability at high temperatures. Consult the datasheet and application notes for guidance on high-temperature operation.
Troubleshooting involves checking the input voltage, output load, and PCB layout. Verify that the device is properly soldered, and the input and output capacitors are correctly placed. Use an oscilloscope to monitor the output voltage and current. Consult the datasheet and application notes for guidance on troubleshooting.